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▲ water-cooled design for evaporation source that stability/lifetime better of process ▲ adopt separate thickness monitoring for each evaporation source that stability for film thickness ▲ automatic program control for film thickness ▲ PLC design and fool-proofing ▲ application: single layer/multi-layer/alloy layer process ▲ customized for substrate holder ▲ Uniformity on 4" wafer ＜±5% |
format
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chamber |
1. material: polished steel (SUS304) 2. chamber size: 500(W)mmX500(H)mmX500(D)mm 3. type: U shape 4. Manual front door (contain view port) |
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holder rotation mechanism |
1. substrate speed rate: Max: 19rpm 2. 4" waferX1 |
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heating capacity |
1. Max 800℃ |
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evaporation system |
1. five kinds of material evaporation at the same time (attach each shutter) |
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system pumping capacity |
1. chamber pressure within 40 mins ＜5.0X10-6 Torr 2. final vacuum: ＜5.0X10-7Torr |
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operating system |
1. With PLC control system and color HMI 2. control mode: automatic/semiautomatic |
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vacuum sensor system |
1. total pressure vacuum gauge: 1ATM~10-9Torr 2. high vacuum pump backing gauge:1ATM~10-4Torr |
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transfer system
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1. chamber size:Φ150X150(H)m/m 2. material: polished steel (SUS304) 3. substrate size: Max 4" 4. direction: vertical or horizontal |